HSIO Technologies and HSIO Circuit Technologies mission is to develop new, exciting, and proprietary technology to address high-density and high-speed interconnect challenges faced by our customers and the semiconductor industry.. HSIO is focused on improving the signal channel through the various circuits, connectors and components our customers use to develop, validate and deploy silicon to the market.
HSIO’s Grypper socket products are unique in that it requires no lid and is the same footprint as the device under test. HSIO Circuit Technologies Flex and Rigid Flex PCB manufacturing featuring < 35 micron lines and spaces and 10 micron feature sizes. The processes enable improved signal integrity, reduced cross-talk, and improved impedance matching by selectively fabricating structures which precisely tune the interconnect device's impedances to those of its operating environment .
Brands: Grypper - Zero Foot Print Test Sockets
ZFP - Spring Pin - Zero Footptint Socket Spring Pins
Multi layer LCP with < than 35 mil Lines and Spaces