Ohmega Technologies, Inc.
Ohmega Technologies, Inc. produces a thin-film Nickel-Phosphorous (NiP) resistive material, trade named OhmegaPly®. The resistive alloy is electroplated onto copper foil and then laminated to a variety of dielectric materials. Using standard subtractive print and etch techniques, a circuit layer is created comprising copper conductive traces and integral resistive elements. The circuit layer can be used as an inner layer of a multilayer printed circuit board, or can be used as the surface layer of a circuit boardMore information on OhmegaPly® can be found at www.ohmega.com
Brands: OhmegaPly®, OhmegaPly RCM ®, OhmegaPly Orbit®, OhmegaPly MTR ®, OhmegaPly 377-FS®,