Oak-Mitsui Technologies LLC
The rapid advancements in technology including the newest data phones, electronic tablets, and high definition video streaming are demanding changes in PCBs, modules, MEMS, and chip package designs. This is revolutionizing the whole data processing infrastructure from computers, servers, routers, switches and data storage. The Ics, chipsets, memory, displays and other components are now performing multi-functions and processing at speeds far greater than ever.
This requires thinner and lighter materials that can provide more power that can be delivered faster with less noise, higher signal integrity, reduced footprint, and more design functionality.
FaradFlex® is the material solution providing the lowest impedance for the best high speed power delivery, minimum noise, optimum signal integrity, thereby eliminating surface mount capacitors, traces, vias, and pads.
Brands: By using FaradFlex® you can optimize signal and power integrity, minimize EMI, reduce surface mount passives and enhance PCB reliability. Applications include PCBs, MEMS/RF modules, and chip packages.