San-ei Kagaku Co., Ltd. manufactures and a wide variety of materials and chemicals required for manufacturing semiconductor package substrates and printed wiring boards. San-ei’s PHP-900 Series of hole-filling paste is the most used brand worldwide. Our UCP Series is a gap fill material to enhance the surface planarity of thick copper PWBs.
Brands: PHP-900 Series via fill material: IR-6P, IR-10F, IR-10FE, IR-10FH, IR-81
UCP Series gap fill materials: 50A-4, 50AL-20